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FR-4 Polyimide Advanced Multiple Layer PCB HASL ENIG OSP Immersion Silver

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FR-4 Polyimide Advanced Multiple Layer PCB HASL ENIG OSP Immersion Silver

Name: FR4 Polyimide Advanced Multiple Layer PCB HASL ENIG OSP Immersion Silver
Brand: ADMG
Price: 1 USD

Brand Name : ADMG

Model Number : OEM/ODM

Certification : ISO14001 ISO9001

Place of Origin : China

MOQ : 2pcs

Price : Negotiation

Payment Terms : L/C, D/A, D/P, T/T

Delivery Time : 5-8 working days

RoHS Compliance : Yes

Surface Mount Technology (SMT) : Yes

Silkscreen : White, Black, Yellow, etc.

Solder Mask : Green, Red, Blue, Black, White, Yellow, etc.

Surface Finish : HASL, ENIG, OSP, Immersion Silver, etc.

Material : FR-4, FR-4 High Tg, Polyimide, Rogers, etc.

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Multiple Layer PCB Introduction:

Multiple Layer PCBs, also known as multilayer printed circuit boards, are advanced electronic circuit boards that consist of more than two conductive layers. These intricate designs offer enhanced functionality, improved signal integrity, and increased component density compared to traditional single or double-layer PCBs.

Multiple Layer PCB Specifications:

Parameter	Description
Number of Layers	4, 6, 8, or more
Copper Thickness	0.5 oz to 2 oz per layer
Dielectric Thickness	0.2 mm to 2 mm
Material	FR-4, Rogers, Polyimide, etc.
Minimum Trace Width	3 mil to 10 mil
Minimum Drill Size	0.3 mm to 0.8 mm
Impedance Control	50 Ω, 75 Ω, or custom
Surface Finish	ENIG, HASL, Immersion Gold, etc.
Solder Mask	Liquid Photo Imageable (LPI), Dry Film
Legend	Silk Screen, Laser Printed

Multiple Layer PCB Application Usage:

Multiple Layer PCBs are widely used in a variety of industries, including telecommunications, aerospace, automotive, industrial automation, and consumer electronics. These advanced circuit boards are essential for designs that require high-speed data transmission, increased component density, and complex interconnections.

Multiple Layer PCB Features:

Improved signal integrity and reduced electromagnetic interference (EMI) due to the shielding effect of the additional layers
Increased component density and more efficient use of board space
Enhanced thermal management capabilities
Ability to route critical signals on dedicated layers
Improved power distribution and ground plane design
Support for advanced technologies like high-speed digital, RF, and mixed-signal circuits

Product Advantages:

Enhanced functionality and performance compared to traditional PCB designs
Increased design flexibility and the ability to address complex circuit requirements
Improved reliability and durability due to the robust multi-layer construction
Cost-effective solution for high-volume production and complex circuit designs
Compatibility with a wide range of manufacturing processes and surface finishes

Request for Quotation (RFQ):

If you are interested in our Custom Tactile Membrane Switch, please provide the following information for a quotation:

Customization requirements, including size, shape, graphics, layout, and backlighting
Quantity needed
Application and industry details
Specific environmental considerations (e.g., waterproof or dustproof requirements)
Delivery time and location requirements

Product Tags:

fr-4 multiple layer pcb

polyimide multiple layer pcb

Wholesale FR-4 Polyimide Advanced Multiple Layer PCB HASL ENIG OSP Immersion Silver from china suppliers

FR-4 Polyimide Advanced Multiple Layer PCB HASL ENIG OSP Immersion Silver Images

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